EW – Production Edition – Bruker Fluorescence Microscopy, EVGGaN-on-Silicon Technology & More
posted on November 14, 2018 |
Advantest Parametric Testing for Manufacturing Next-Generation ICs
V93000 platform. (Image courtesy of Advantest.)
Advantest has introduced its V93000 SMU8 parametric tester to meet chip makers’ process-characterization and monitoring needs for the exacting measurements required on the 28nm to 3nm process nodes and beyond.
With per-pin source measurement units (SMU) for next-generation DC parametric testing, the system allows users to measure and verify electrical and timing characteristics at any device pin, thereby enabling more cost-efficient manufacturing and faster time to market for new IC designs.
For more information, visit Advantest’s website.
Bruker Light-Sheet Fluorescence Microscopy
LuxendoMuVi SPIM CS. (Image courtesy of Bruker.)
Bruker has released its LuxendoMuVi SPIM CS light-sheet fluorescence microscope for imaging optically cleared samples. The MuVi SPIM allows for fast, long-term imaging of large samples with increased resolution and optical sectioning, as well as minimized photo damage.
The MuVi SPIM CS is an extension of the MuVi SPIM capabilities to provide 3D imaging of cleared samples. The Cleared Sample Module is an add-on consisting of an exchangeable cleared sample optical core unit (octagon) and an overhead sample-positioning unit installed on the microscope’s top plate.
For more information, visit Bruker’s website.
EVG GaN-on-Silicon Monolithic MicroLED Technology
GEMINI Automated production wafer bonding system. (Image courtesy of EVG.)
EVG has collaborated with Plessey to develop GaN-on-Silicon (GaN-on-Si) monolithic microLED technology for AR applications. EVG’s SmartViewNT Automated Bond Alignment System allows face-to-face alignment of the wafers with high precision.
Furthermore, a maximum level of automation and process integration is achieved by the GEMINI Automated Production Wafer Bonding System. Wafer-to-wafer alignment and wafer bonding processes up to 300mm for volume manufacturing are all performed in one automated platform.
For more information, visit EVG’s website.
LPKF Transmission Measurement
TMG 3 transmission measurement. (Image courtesy of LPKF.)
LPKF has launched its TMG 3 measuring device. With it, the transparency properties of plastics can be checked within a few seconds before welding. Since the optical transmission of the plastic is one of the decisive factors for the quality of the joint, and since preceding process steps influence this, the control of the transmission properties prior to laser plastic welding is usefulfor quality assurance.
For more information, visit LPKF’s website.
NordsonAutomated Wafer X-ray Inspection
DAGE Quadra W8 wafer inspection. (Image courtesy of Nordson.)
Nordson has unveiled its Quadra W8, a lab-based system for wafer level inspection with increased magnification and image quality. Integrated dual port EFEM provides wafer protection by removing any manual wafer handling so that operators can inspect wafer level quality directly from the FOUP.
The platform’s Aspire 6.7 MP detector, image enhancement filters and image chain reveal defects as small as 0.1µm, letting the Quadra W8 create clear images and also makingit easy to see tiny details and find defects quickly.
For more information, visit Nordson’s website.